Placing System Hardware
Chapter 3
3-7
Figure 3.2
I/O
Chassis and 1771P2 Power Supply Dimensions
315mm
(12.41")
610mm
(24.01")
16-slot 1771-A4B
483mm
(19.01")
12-slot 1771-A3B1
356mm
(14.01")
229mm
(9.01")
8-slot 1771-A2B
4-slot 1771-A1B
254mm
(10")
12-slot
8-slot
4-slot
16-slot
1771P1
1771P2
1771P7
1771PS7
Power Supply
Use .25" dia
mounting bolts
(4 places)
12451I
91mm
(3.6")
591mm
(23.25")
464mm
(18.25")
337mm
(13.25")
210mm
(8.25")
Clearance depth is 204 mm (8 in) for 8 I/O connection points per module.
See Figure 3.3 for the recommended grounding configuration for remote
I/O systems.
Figure 3.3
Recommended
Grounding Configuration for Remote I/O Systems
Enclosure
Grounding Electrode Conductor
To Grounding
Electrode
System
Ground
Bus
I/O Chassis Wall
Ground
Lug
Nut
Star
Washer
Ground Lug
15561
Grounding Configuration
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